Teledyne FLIR BOSON 640 x 512 8.7mm 50° HFoV - Shutterless LWIR Thermal Camera Core

$4,231.00

• Resolution: 640x512
• Shutterless
• 50° HFoV
• 12 µm pixel pitch VOx microbolometer
• Multiple high-performance FOV options
• Multiple levels of sensitivity starting at <40 mK
• 21 x 21 x 11 mm camera body
• Weight as low as 7.5 grams
• Low power consumption, starting at 500 mW
• Rugged construction and highest temperature rating -40 °C to +80 °C




Boson Consumer Grade <60mK NEDT SKU:21640A050-6CAAX - $4231.00
Boson Professional Grade <50mK NEDT SKU:21640A050-6PAAX - $5289.00
Boson Industrial Grade <40mK NEDT SKU:21640A050-6IAAX - $6347.00

Interfaces and Accessories sold separately.

We usually have a majority of these items in stock. Please call or contact us for availability.

SKU: 21640A050-9CAAX
Description
Specifications
Downloads

FLIR Boson - 8.7mm Lens

Compact Shutterless LWIR Thermal Camera Core

The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.

With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.

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DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE

A full-featured VGA thermal camera module at less than 4.9cm3.

  • 21 x 21 x 11 mm camera body and weight as low as 7.5g.
  • Low power consumption, starting at 500 mW
  • 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
  • Rugged construction and -40 °C to 80 °C.
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POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.

  • Embedded noise filters, gain control, blending, and more.
  • Software-customizable processing and power options.
  • Built-in support for interface standards.
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WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET

Unprecedented integration flexibility for fast, affordable developments.

  • Custom applications via third-party developers.
  • Mechanical/electrical compatibility across versions.
  • OEM integration flexibility.

Resolution

640 x 512

["Pixel Pitch "]

["\t 12 µm"]

["Spectral Band "]

["\t LWIR | 8 µm – 14 µm"]

["Noise Level (NEdT Value"]

["\t Boson Consumer Grade <60 mK NEdT, Boson Professional Grade <50 mK NEdT, Boson Industrial Grade <40 mK NEdT"]

["Frame Rate Option"]

["\t <9 Hz Slow Frame Rate, 60Hz default; 30 Hz runtime selectable"]

["Shutter"]

["\t No"]

["Solar protection"]

["\t Integral"]

["Continuous Digital Zoom"]

["\t 1X to 8X zoom"]

["Symbology"]

["\t Re-writable each frame; alpha blending for translucent overlay"]

["Radiometry"]

["\t No"]

["Scene Dynamic Range"]

["\t to 140 °C (high gain) to 500 °C (low gain)"]

["Temperature Accuracy"]

—

["Field of View "]

["\t 50° HFoV"]

["Focal Length "]

["\t 8.7mm"]

["Short Lens"]

["\t No"]

["f-number "]

["\t f/1.0"]

["Dimensions (L x W x H)"]

["\t 21 × 21 × 11 mm without lens"]

["Weight"]

["\t 7.5 g without lens (configuration dependent)"]

["Precision Mounting Holes"]

["\t Four tapped M1.6 x 0.35 (rear cover). Lens support recommended when lens mass exceeds core mass."]

["Input Voltage"]

["\t 3.3 VDC"]

["Power Dissipation"]

["\t Varies by configuration. 320+ as low as 500 mW, 640+ as low as 1000 mW"]

["Video Channels"]

["CMOS or USB2"]

["Control Channels"]

["\t UART or USB"]

["Configurable GPIO"]

["\t Up to 11; user configurable"]

["Operating Temperature Range"]

["\t -40°C to 80°C"]

["Non-Op. Temp. Range"]

["\t -50 °C to 85 °C (-58 °F to 185 °F)"]

["Shock"]

["\t 1, 500 g @ 0.4 msec"]

["Operational Altitude"]

["\t 12 km (max altitude of a commercial airliner or airborne platform)"]

["Boson Enclosure Compatible"]

["\t Yes"]

IDD CAD Data Boson 640SL - 8.7mm-f1.0


This IDD CAD Data package includes a comprehensive set of design resources, featuring a .STEP file and an accompanying PDF. The .STEP file provides a detailed 3D model that ensures compatibility with various CAD software, facilitating seamless integration into your projects. The PDF offers essential documentation, including specifications, dimensions, and guidelines to help you make the most of the provided CAD data. Download the zip file to access these valuable resources for your design and engineering needs.

Download

Teledyne FLIR Boson Datasheet

Download

Boson Family Brochure

Download

Resolution lens Options

Color Palette Comparison

Fieldometer

Field of View Ratio Rule

Export Conditions

Thermal Simulator