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FLIR Boson - 14mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
FLIR Boson+ 320 - 4.5mm Short Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
Your Application, Now With Radiometry.
Why Radiometry?
There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.
Built-In Spot Meter Accuracy
Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
FLIR Boson - 24.4mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
FLIR Boson+ - 4.9mm Short Lens
Compact LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
FLIR Boson+ - 4.9mm Short Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
FLIR Boson 18mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Environmental Enclosure
for the Teledyne FLIR Boson
In today's technological world, it is crucial to protect your Teledyne FLIR Boson Thermal Imaging Camera from environmental factors that can lead to costly damages and loss of productivity. The RHP Boson Environmental Enclosure is a cutting-edge solution that ensures the safety and longevity of your valuable devices. With its IP67 rating and exceptional features, this enclosure is the ultimate choice for safeguarding your camera.
IP67 Rated Protection
One of the standout features of the RHP Boson Environmental Enclosure is its IP67 rating. This international standard certifies the enclosure's ability to provide complete protection against the intrusion of dust and water.
IP67 rating stands for:
- IP (Ingress Protection)
- 6 (dust-tight protection)
- 7 (protection to withstand temporary submersion in water up to depths of 150mm to 1000mm deep for 30 minutes).
Whether the Boson is operating in a dusty industrial environment or exposed to heavy rainfall in an outdoor setting, the Boson Environmental Enclosure guarantees uncompromised protection against these elements.
| Strength and Durability | The Boson Enclosure is made from black anodized machined aluminum, offering exceptional strength and durability. It keeps your device protected even in demanding environments. | |
| 40mm Diamond Coated Zinc Sulfide (ZnS) Glass: Crystal Clear Vision | Features 40mm diamond-coated Zinc Sulfide (ZnS) glass for crystal clear vision and precise temperature readings. The coating protects against scratches and damage for long-term use. | |
| Anti-Reflective Coating: Optimal Performance | Internal anti-reflective DLC coating minimizes glare and reflections, ensuring optimal performance even in bright lighting conditions. | |
| Easy Installation with Two x 1/4-20 Mount Points | Dual 1/4"-20 mounts allow flexible and easy installation on walls, ceilings, or other surfaces. | |
| Convenient Connectivity with 4-Pin Hirose to JST Connector | Provides a secure connection between the interface board and enclosure, ensuring reliable operation. | |
| 4-Pin to USB2 Cable Included: Seamless Integration | Includes a 4-pin to USB2 cable for easy setup and seamless integration into existing systems. |
FLIR Boson+ 24mm Lens - Shutterless
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON+ - 9.2mm Short Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
FLIR Boson - 4.9mm
Compact LWIR Radiometric Thermal Camera
The Boson longwave infrared (LWIR) radiometric thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
Your Application, Now With Radiometry.
Why Radiometry?
There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.
Built-In Spot Meter Accuracy
Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and highest temperature rating -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Includes embedded algorithms for noise filters, gain control, blending, and more.
- Software-customizable functionality for video processing and power dissipation requirements.
- Built-in support for physical and protocol-level interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Customized applications through FLIR-trusted third party developers.
- Mechanical/electrical compatibility across all versions.
- Variety of hardware and image processing integration to fit OEM requirements.
FLIR Boson - 14mm Lens
Compact LWIR Radiometric Thermal Camera
The Boson longwave infrared (LWIR) radiometric thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
Your Application, Now With Radiometry.
Why Radiometry?
There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.
Built-In Spot Meter Accuracy
Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and highest temperature rating -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Includes embedded algorithms for noise filters, gain control, blending, and more.
- Software-customizable functionality for video processing and power dissipation requirements.
- Built-in support for physical and protocol-level interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Customized applications through FLIR-trusted third party developers.
- Mechanical/electrical compatibility across all versions.
- Variety of hardware and image processing integration to fit OEM requirements.
FLIR Boson - 8.7mm Lens
Compact LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
FLIR Boson - 9.1mm Lens
Compact LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
FLIR Boson+ - 2.3mm Lens Radiometric
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
Your Application, Now With Radiometry.
Why Radiometry?
There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.
Built-In Spot Meter Accuracy
Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
FLIR Boson+ 18mm Lens Shutterless
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.