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FLIR Boson - 8.7mm Lens
Compact Shutterless LWIR Thermal Camera Core
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
FLIR Boson - 9.2mm Short Lens
Compact LWIR Radiometric Thermal Camera
The Boson longwave infrared (LWIR) radiometric thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
Your Application, Now With Radiometry.
Why Radiometry?
There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.
Built-In Spot Meter Accuracy
Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and highest temperature rating -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Includes embedded algorithms for noise filters, gain control, blending, and more.
- Software-customizable functionality for video processing and power dissipation requirements.
- Built-in support for physical and protocol-level interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Customized applications through FLIR-trusted third party developers.
- Mechanical/electrical compatibility across all versions.
- Variety of hardware and image processing integration to fit OEM requirements.
FLIR Boson - 9.2mm Short Lens
Compact Shutterless LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
FLIR Boson 9.2mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
FLIR Boson - Lensless Core
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
FLIR Boson - Lensless Core
Compact Shutterless LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Camera Link Accessory Kit
For the FLIR Boson Thermal Imaging Cameras
Expansion board for Boson cameras that matches the functionality of the VPC module, and enables the camera to be interfaced to a Camera Link frame grabber, allowing the capture of digital 16-bit video data.
(This product does not include Camera Link cable, frame grab board, or data capture software.)
Boson Test Board, Detail PCB ASSEMBLY
Boson Development Board
The Development breakout board for Boson users and integrators that need easy access to the Boson I/O and interfaces. This board is intended for user development purposes, and is not intended or rated for long term reliability over temperature.
It provides full access to the Boson 80-pin connector with a number of connectors:
- standard USB-3 micro-B (Super Speed) receptacle
- standard SDR-26 receptacle with Camera-Link compliant output
- SDIO card slot
- UART header
- I2C header
- SPI header
- Power jacks
The focus-tool accessory, allows any FLIR Boson lens which cannot be focused by hand to be focused by engaging the appropriate slots on the lens barrel such that it can be rotated inside the lens flange. (The focus tool has been properly sized such that no vignetting results when it engages the slots on the lens barrel.) Note that lens configurations with focal length >25mm do not require a focus tool since focus is achieved by simply turning the outer barrel of the lens assembly by hand.
This product is NOT compatible with the following FLIR Boson Thermal Imagers:
Teledyne FLIR Boson MIPI Development Accessory Board
Take your imaging projects to the next level with the Teledyne FLIR MIPI Development Accessory Board. Featuring support for pixel formats like RAW8, 16-bit UYVY, and RAW14, this board offers unparalleled flexibility for your thermal imaging needs.
Whether you're working in single channel mode or dual channel mode, this accessory board provides incredible image quality and clarity. And with a lightning-fast MIPI DDR clock rate of 246 MHz and a latency under 4.8ms, you can count on this board for seamless image processing.
FLIR Boson SX8 - 12mm Lens
1280 × 1024 Resolution, 8-micron, SWaP-Optimized LWIR Camera Module
Boson® SX8 is the world’s first high-volume production, ITAR-free and NDAA-compliant uncooled longwave infrared (LWIR) camera module to deliver SXGA (1280 × 1024) resolution with an 8-micron (µm) pixel-pitch microbolometer. Engineered to minimize size, weight, and power (SWaP), Boson SX8 improves situational awareness in a compact, integration-ready form factor. Purpose-built for industrial, commercial, and defense integrations, Boson SX8 delivers 4× more pixels than a 640 × 512 VGA module, extending detection, recognition, and identification (DRI) range and providing clear imagery at long distances.
Multiple lens options, including a factory integrated continuous zoom lens, support a wide range of platforms, from uncrewed systems and counter-UAS to seekers, perimeter security, visual augmentation, and handheld devices. With high-speed performance and SXGA output, Boson SX8 helps operators see more, see farther, and do more. Boson SX8 helps accelerate development and reduce integration risk with an available graphical user interface (GUI), germanium-free lens configurations, and compatibility with Teledyne FLIR OEM’s Prism™ intelligent digital products. Manufactured at scale in the USA, it offers lower supply-chain risk, high reliability, and world-class support from a trusted volume supplier—setting a new standard for SWaP-optimized thermal imaging.
High-performance 1280 × 1024 clarity in a SWaP-optimized package
- New SWaP-optimized 8 µm pixel pitch
- Market-leading 1280 × 1024 (SXGA) resolution
- 30 Hz and 60 Hz with roadmap to higher frame-rate options
Integration-ready design that is AI-ready
- Boson SX8 GUI available
- Multiple lens options, including Ge-free models
- Compatible with intelligent Prism digital products
- Compact, factory-integrated CZ lens option
A trusted development partner and low-risk volume supplier
- World-class support and service
- ITAR-free and NDAA-compliant
- High-volume manufacturing in the USA
- Classified under U.S. Department of Commerce jurisdiction as EAR 6A003.b.4.b
FLIR Boson SX8 - 18mm Lens
1280 × 1024 Resolution, 8-micron, SWaP-Optimized LWIR Camera Module
Boson® SX8 is the world’s first high-volume production, ITAR-free and NDAA-compliant uncooled longwave infrared (LWIR) camera module to deliver SXGA (1280 × 1024) resolution with an 8-micron (µm) pixel-pitch microbolometer. Engineered to minimize size, weight, and power (SWaP), Boson SX8 improves situational awareness in a compact, integration-ready form factor. Purpose-built for industrial, commercial, and defense integrations, Boson SX8 delivers 4× more pixels than a 640 × 512 VGA module, extending detection, recognition, and identification (DRI) range and providing clear imagery at long distances.
Multiple lens options, including a factory integrated continuous zoom lens, support a wide range of platforms, from uncrewed systems and counter-UAS to seekers, perimeter security, visual augmentation, and handheld devices. With high-speed performance and SXGA output, Boson SX8 helps operators see more, see farther, and do more. Boson SX8 helps accelerate development and reduce integration risk with an available graphical user interface (GUI), germanium-free lens configurations, and compatibility with Teledyne FLIR OEM’s Prism™ intelligent digital products. Manufactured at scale in the USA, it offers lower supply-chain risk, high reliability, and world-class support from a trusted volume supplier—setting a new standard for SWaP-optimized thermal imaging.
High-performance 1280 × 1024 clarity in a SWaP-optimized package
- New SWaP-optimized 8 µm pixel pitch
- Market-leading 1280 × 1024 (SXGA) resolution
- 30 Hz and 60 Hz with roadmap to higher frame-rate options
Integration-ready design that is AI-ready
- Boson SX8 GUI available
- Multiple lens options, including Ge-free models
- Compatible with intelligent Prism digital products
- Compact, factory-integrated CZ lens option
A trusted development partner and low-risk volume supplier
- World-class support and service
- ITAR-free and NDAA-compliant
- High-volume manufacturing in the USA
- Classified under U.S. Department of Commerce jurisdiction as EAR 6A003.b.4.b
FLIR Boson SX8 - 24mm Lens
1280 × 1024 Resolution, 8-micron, SWaP-Optimized LWIR Camera Module
Boson® SX8 is the world’s first high-volume production, ITAR-free and NDAA-compliant uncooled longwave infrared (LWIR) camera module to deliver SXGA (1280 × 1024) resolution with an 8-micron (µm) pixel-pitch microbolometer. Engineered to minimize size, weight, and power (SWaP), Boson SX8 improves situational awareness in a compact, integration-ready form factor. Purpose-built for industrial, commercial, and defense integrations, Boson SX8 delivers 4× more pixels than a 640 × 512 VGA module, extending detection, recognition, and identification (DRI) range and providing clear imagery at long distances.
Multiple lens options, including a factory integrated continuous zoom lens, support a wide range of platforms, from uncrewed systems and counter-UAS to seekers, perimeter security, visual augmentation, and handheld devices. With high-speed performance and SXGA output, Boson SX8 helps operators see more, see farther, and do more. Boson SX8 helps accelerate development and reduce integration risk with an available graphical user interface (GUI), germanium-free lens configurations, and compatibility with Teledyne FLIR OEM’s Prism™ intelligent digital products. Manufactured at scale in the USA, it offers lower supply-chain risk, high reliability, and world-class support from a trusted volume supplier—setting a new standard for SWaP-optimized thermal imaging.
High-performance 1280 × 1024 clarity in a SWaP-optimized package
- New SWaP-optimized 8 µm pixel pitch
- Market-leading 1280 × 1024 (SXGA) resolution
- 30 Hz and 60 Hz with roadmap to higher frame-rate options
Integration-ready design that is AI-ready
- Boson SX8 GUI available
- Multiple lens options, including Ge-free models
- Compatible with intelligent Prism digital products
- Compact, factory-integrated CZ lens option
A trusted development partner and low-risk volume supplier
- World-class support and service
- ITAR-free and NDAA-compliant
- High-volume manufacturing in the USA
- Classified under U.S. Department of Commerce jurisdiction as EAR 6A003.b.4.b
Boson Tripod Mount
The Tripod-mount accessory, provides a means to mount a Boson assembly (or a Boson configured with either the VPC Accessory or the Camera Link Accessory) to a tripod via a standard 1/4-20 thread. It is designed to interface to the rear of the Boson via 4 x M1.6 screws.